Method and apparatus for mounting component

ABSTRACT

A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body. Since the component is mounted on the already divided component, as compared with the prior art, no trouble is given rise to at a junction part between the divided component and the component, thus contributing to an improvement in product quality.

[0001] This is a divisional application of Ser. No. 09/266,928, filedMar. 12, 1999.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a method for supplying a dividedcomponent which is separated previously into individual parts and isstored in a storage body and bringing a divided component after beingprocessed back into the storage body, and an apparatus for executing themethod. The divided component is, e.g., individual semiconductorsubstrate cut from a semiconductor wafer.

[0004] 2. Description of Related Art

[0005] A circuit board with a plurality of the same circuit sections 24formed therein, that is, a bulk circuit board 23 is sent to anelectronic component mounting apparatus to secure high productivity, asshown in FIG. 18. Every one or every plurality of electronic components21 held by an electronic component mounting nozzle 20 are mounted to thecircuit sections 24 of the circuit board 23 by the nozzle 20. A circuitboard with the electronic components mounted is carried out when theelectronic components 21 are mounted to all circuit sections 24 of thecircuit board 23. The component mounted circuit board is separated intoindividual circuit parts 26 with the electronic components and then theseparated circuit parts 26 are supplied to a next process.

[0006] In the case where the electronic components 21 are mounted to thecircuit sections 24 by flip-chip mounting, more specifically, electrodes28 on each circuit section 24 are connected to electrodes 25 of thecorresponding electronic component 21 via bumps 22 as shown in FIG. 19,and then the circuit board 23 is separated into individual circuit parts26 by a cracking along scribe lines. In this case, since the circuitsections 24 are warped, a stress acts on each connected part between theelectrodes 28 on the circuit section 24 and the electrodes 25 on theelectronic component 21. Thus the connected part may be disconnected bythe stress, that is, the stress may cause a junction failure. Forsolving the problem, the circuit board 23 is separated beforehand intothe individual circuit sections 24 and the divided circuit sections 24are supplied to the electronic component mounting apparatus for mountingof the electronic components 21 thereto, and then individual circuitparts 26 mounting the electric components 21 thereon are transferred tothe next process as mentioned above.

[0007] However, an effective means for supplying each divided circuitsection 24 to the electronic component mounting apparatus andtransferring the finished circuit parts 26 to the next process has notyet been devised.

SUMMARY OF THE INVENTION

[0008] The present invention accordingly provides a method for mountingcomponents and an apparatus for executing the method whereby eachdivided component can be supplied in a manner that will not give rise toa junction failure at a junction part where the divided component and acomponent mounted on the divided component are connected. Also, adivided component with the component mounted on the divided componentcan be transferred, so that the divided component with the componentmounted thereto is improved in quality.

[0009] According to a first aspect of the present invention, there isprovided a method for mounting component which comprises:

[0010] taking out a divided component separated from a collective partfrom a storage body;

[0011] mounting a component to the taken divided component; and

[0012] storing a divided component with the component mounted theretointo the storage body again.

[0013] According to a second aspect of the present invention, there isprovided an apparatus for mounting component, which comprises:

[0014] a storage body for storing a divided component separated from acollective part;

[0015] a take-out and storage unit which takes out the divided componentfrom the storage body, brings back the divided component with componentmounted thereto into the storage body, further transfers the dividedcomponent from the storage body to a component mount stage where thecomponent is mounted to the divided component and transfers the dividedcomponent with the component mounted thereto from the component mountstage to the storage body;

[0016] a mounting unit which mounts the component to the dividedcomponent taken out by the take-out and storage unit thereby forming thedivided component with the component mounted thereto; and

[0017] a control unit which controls operations of the take-out andstorage unit and the mounting unit.

[0018] According to the component mount method in the first aspect ofthe present invention and the component mounting apparatus in the secondaspect of the present invention, there are provided the take-out andstorage unit and the mounting unit, whereby the component is mounted tothe divided component taken out from the storage body and then thedivided component with the component mounted thereto is collected intothe storage body again. Accordingly, regarding any component such that aproblem is occurred when a collective part mounting components theretois separated to a respective divided component with the componentmounted thereto as the conventional art, in the present invention, thedivided component separated previously from the collective part can besupplied by the storage body storing the divided component, and thecomponent can be mounted to the individual divided component. Therefore,each divided component with the component mounted thereto is improved inquality without the inconvenience experienced in the prior art.Moreover, the divided components with the components can be collectedagain into the storage body, so that each divided component can behandled with ease.

BRIEF DESCRIPTION OF THE DRAWINGS

[0019] These and other objects and features of the present inventionwill become clear from the following description taken in conjunctionwith the preferred embodiment thereof with reference to the accompanyingdrawings in which:

[0020]FIG. 1 is a perspective view of a component mounting apparatusembodied by the present invention;

[0021]FIG. 2 is a perspective view of a feed collection unit of FIG. 1;

[0022]FIG. 3 is a side view showing in detail a transfer unit, aprotecting member removal device and a protecting member set device inthe feed collection unit of FIG. 2;

[0023]FIG. 4 is a side view showing in detail the protecting memberremoval device in the feed collection unit of FIG. 2;

[0024]FIG. 5 is a perspective view of a framed substrate and anoscillating element handled by the component mounting apparatus of FIG.1;

[0025]FIG. 6 is a sectional view of a storage body used in the feedcollection unit of FIG. 1;

[0026]FIG. 7 is a perspective view of a take-out and storage unit ofFIG. 1;

[0027]FIG. 8 is a diagram that is explanatory of the operation of thetake-out and storage unit of Fig: 7;

[0028]FIG. 9 is a perspective view of a component mount stage of FIG. 1;

[0029]FIG. 10 is a side view of a stage plate of the component mountstage of FIG. 9;

[0030]FIG. 11 is a plan view of a driving member and a driving unit ofFIG. 10;

[0031]FIG. 12 is a perspective view of a mounting unit of FIG. 1;

[0032]FIG. 13 is a perspective view of a modified example of thecomponent mounting apparatus of FIG. 1;

[0033]FIG. 14 is a perspective view of a further modified example of thecomponent mounting apparatus of FIG. 1;

[0034]FIG. 15 is a perspective view of the take-out and storage unit ofFIG. 13;

[0035]FIG. 16 is a perspective view of the take-out and storage unit ofFIG. 14;

[0036]FIG. 17 is a sectional view of a modified example of the storagebody of FIG. 6;

[0037]FIG. 18 is a perspective view of a conventional method formounting components on a circuit board before being divided intoindividual components; and

[0038]FIG. 19 is a side view showing a mount state of the circuit boardand the component.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0039] A method for mounting components, and an apparatus for executingthe method embodied by the present invention will be described withreference to the drawings throughout which like parts are designated bylike reference numerals. An example functioning as the “dividedcomponent” in the above SUMMARY OF THE INVENTION corresponds to a“framed substrate 53” and an example functioning as the “dividedcomponent having the component mounted thereto” corresponds to a “SAWfilter 50” in the description below of the embodiment.

[0040] Components handled in the method and apparatus of the presentinvention are electronic components, particularly, oscillationelectronic components such as SAW (Surface Acoustic Wave) filters,quartz oscillators, etc as an example. For instance, as shown in FIG. 5,the SAW filter has a frame body 52 on a substrate 51 on which a wiringpattern is formed. The SAW filter has a construction including anoscillating element 54 that is flip-chip mounted via the wiring patternand bumps onto a storage section surrounded by the frame body 52, and alid is then capped to the frame body 52, thereby sealing the oscillatingelement 54. Generally, an adhesive is applied between the substrate anda chip or the chip is sealed so as to increase a junction strengthbetween the substrate and chip at the flip-chip mounting of theelectronic component. However, in the case of the SAW filter 50utilizing the oscillation of the oscillating element 54 for theoperation, the adhesive or sealant restricts the oscillation of theoscillating element 54 and therefore the substrate 51 and theoscillating element 54 are connected solely via, e.g., a gold bump,without using the adhesive or sealant. So, as described above, after aplurality of SAW filters are formed on one substrate previously and thesubstrate is cracked and separated into individual SAW filters, the warpof the substrate that occurs due to the cracking and separation mayinvite a break in the part connected via the bump, which then results inan electric connection failure. It is accordingly preferable for the SAWfilter 50 that the substrate 51 with the frame body 52 (referred to as a“framed substrate 53” hereinafter), which is separated previously, issupplied individually as the divided component and the oscillatingelement 54 is flip-chip mounted to the individual framed substrate 53.The SAW filter 50 in the embodiment is 2 mm×3 mm and the oscillatingelement 54 is 0.5 mm×0.5 mm.

[0041] Although the framed substrate 53 is exemplified as the dividedcomponent in the method and apparatus of the embodiment of the presentinvention, the divided component is not limited to the framed substrate53 and corresponds to any component that after it is finished as acollective part, the collective part cannot be separated conveniently.

[0042] The apparatus for mounting components will be described first. Acomponent mounting apparatus 101 of the embodiment shown in FIG. 1roughly comprises a feed collection unit 201, a take-out and storageunit 301, a mounting unit 401, a component feed unit 501, a verticalvisual field optical device 551, a component image pickup device 571 anda control unit 601.

[0043] The feed collection unit 201 constructed as indicated in FIG. 2supplies the framed substrates 53 to the take-out and the storage unit301 and also receives, that is, collects the SAW filters 50 from thetake-out and storage unit 301. The feed collection unit 201 includes astorage body 211 storing the framed substrates 53 and SAW filters 50, afeed reel 221 to which the storage body 211 storing the framedsubstrates 53 is wound, a collection reel 222 to which the storage body211 storing the SAW filters 50 is wound, a transfer device 231 fortransferring the storage body 211 from the feed reel 221 to thecollection reel 222, a protecting member removable device 241 forremoving a first protecting member 215 fitted beforehand to the storagebody 211 and a protecting member set device 251 for setting a secondprotecting member 216 to the storage body 211.

[0044] The storage body 211 is formed of a resin material in a flexibletape as shown in FIG. 1. Concave storage sections 212 are formed in thestorage body via a constant distance in an extension direction forstoring the framed substrates 53 as the divided components and the SAWfilters 50, as is clear from FIG. 6. The storage body 211 in theembodiment is formed of the resin material that is light transmissibleso that the presence/absence of the framed substrate 53 in the storagesection 212 can be detected from the presence/absence of light from alight-emitting diode (LED) 291. Moreover, the storage body 211 has anopening 214 penetrating a bottom plate 212 a of each storage section 212to enable the light generated from the LED 291 arranged opposite to thebottom plate 212 a to reach the framed substrate 53 through the bottomplate 212 a. The LED 291 is installed at a light-emitting detectingdevice 290 and is disposed, as will be described later, at a take-outstorage position 292 where the framed substrates 53 are taken out andthe SAW filters 50 are stored. The light-emitting detecting device 290detects the presence/absence of the framed substrates 53 and SAW filters50 in the storage sections 212 and sends detected information to thecontrol unit 601. In the present embodiment, the take-out and storageunit 301 to be described later takes out five framed substrates 53 atone time at the take-out storage position 292, and therefore five LEDs291 are arranged to face the corresponding storage sections 212 at thetake-out storage position 292.

[0045] An area at the entrance side of the storage section 212 is madelarger than an area of the bottom plate 212 a to facilitate storage ofthe framed substrate 53 and SAW filter 50. More specifically, a taper213 is formed at the storage section 212 as indicated in FIG. 6.Furthermore, the area of the bottom plate 212 a is made equal to an areaof a base of the framed substrate 53 in order to prevent the framedsubstrate 53 and SAW filter 50 from rattling in the storage section 212.

[0046] The first protecting member 215 and second protecting member 216are attached adhesively to an upper face 212 b of the storage body 211to prevent the framed substrates 53 and SAW filters 50 from dropping outof the storage sections 212 and prevent dust, etc. The first protectingmember 215 is peeled-off from the upper face 212 b of the storage body211 immediately before the framed substrates 53 are taken out from thestorage sections 212 at the take-out storage position 292. The secondprotecting member 216 is attached adhesively to the upper face 212 bimmediately after the SAW filters 50 are accommodated in the storagesections 212 at the take-out storage position 292.

[0047] The feed reel 221 and the collection reel 222 respectively feedand wind the storage body 211 in synchronization with the transfer ofthe storage body 211 by the transfer device 231 under the control of thecontrol unit 601. A tensioner is set to each of the feed reel 221 andcollection reel 222 to prevent the tape-like storage body 211 fromslackening.

[0048] As shown in FIGS. 2-4, the transfer device 231 has a drivingportion 232, a transfer roller 233 and a driving mechanism 234 driven bythe driving portion 232 to intermittently rotate the transfer roller233. The driving portion 232 in the embodiment is an air cylinderreciprocating subsequent to the supply of air, thereby rotating a firstroller 235 of the driving mechanism 234 forward and rearward with aconstant rotational angle. The forward-rearward rotation of the firstroller 235 is transmitted via a belt 238 to a second roller 236, so thatthe second roller 236 is rotated forward and rearward synchronously withthe rotation of the first roller 235. The second roller 236 is atransmission device, having a ratchet wheel, coupled to the transferroller 233 via a ratchet gearing having a one-way intermittent feedfunction. The transfer roller 233 is intermittently rotated by everyfixed angle in a direction of an arrow I consequent to theforward-rearward rotation of the second roller 236. A press roller 237presses the storage body 211 to the transfer roller 233, so that thestorage body 211 is intermittently transferred in the I directionsynchronously with the intermittent rotation of the transfer roller 233.In the illustration of FIG. 2, the numeral “233” indicates only a gearset outside. Actually the transfer roller 233 is disposed so as to facethe press roller 237 inside a frame 281 constituting the feed collectionunit 201, and is formed integrally with the gear and is a gear wheelengaged with the storage body 211.

[0049] The storage body 211 moves from the feed reel 221 along an upperedge of the frame 281 in a direction of an arrow II. Immediately beforethe storage body 211 reaches the take-out storage position 292, thefirst protecting member 215 is peeled off by the removal device 241.Immediately after the storage body 211 passes the take-out storageposition 292, the second protecting member 216 shuts the storagesections 212 of the storage body 211 by the set device 251. The storagebody 211 thereafter is sent via the transfer roller 233 along a loweredge of the frame 281 in a direction of an arrow III and wound on thecollection reel 222.

[0050] The protecting member removal device 241 peels off the tape-likefirst protecting member 215, which is of approximately the same breadthas the storage body 211 and is adhered to the upper face 212 b of thestorage body 211, as discussed earlier. The removal device 241 has atransmission mechanism 242 so that the device is driven by a drivingforce generated by the driving portion 232 of the above transfer device231. The removable device 241 further includes a wind reel 244 to windthe removed first protecting member 215. The transmission mechanism 242has an arm 243 reciprocating interlockingly with the reciprocationgenerated by the driving portion 232 and, an intermittent rotarymechanism 245 which is set on the wind reel 244 and intermittentlyrotates the wind reel 244 by every constant angle in a direction of anarrow IV in correspondence to the reciprocation of the arm 243, i.e., insynchronization with the transfer operation for the storage body 211.The first protecting member 215 is accordingly wound to the wind reel244 synchronously with the intermittent transfer of the storage body 211by the transfer device 231.

[0051] The protecting member set device 251 attaches the tape-likesecond protecting member 216, which is of approximately the same breadthas the storage body 211, to the upper face 212 b of the storage body211. The set device 251 includes a second protecting member reel 252 forwinding the second protecting member 216 and a pressing roller 254 forpressing and adhering the second protecting member 216 to the upper face212 b of the storage body 211. The second protecting member reel 252sends out the second protecting member 216 by a driving device 253 whichis a motor in the embodiment and controlled by the control unit 601. Thepressing roller 254 can be moved in a thicknesswise direction of thestorage body 211 through driving of a roller movement portion 255 whichis an air cylinder in the embodiment, thereby controlling a press forcefor applying the second protecting member 216 to the storage body 211.The operation of the roller movement portion 255 is controlled by thecontrol unit 601, and therefore the above press force is controlled bythe control unit 601. In the construction described above, the secondprotecting member 216 is sent out from the second protecting member reel252 in synchronization with the transfer operation for the storage body211 under the control by the control unit 601, and is pressed andattached to the upper face 212 b of the storage body 211 by the pressingroller 254.

[0052] The take-out and storage unit 301 will be described. As shown inFIG. 7, the take-out and storage unit 301 comprises a holding transferdevice 311, a heating stage 331 and a cooling stage 341. In FIG. 8, theholding transfer device 311 takes out the framed substrates 53 from thestorage sections 212 of the storage body 211 transferred to the takeoutstorage position 292, transfers via the heating stage 331 to a componentmount stage 411 of a mounting unit 401 which will be described later,and also transfers the SAW filters 50 from the mount stage 411 via thecooling stage 341 to the take-out storage position 292 to store the SAWfilters 50 in the storage sections 212 of the storage body 211.

[0053] The holding transfer device 311 has an up-and-down rotary portion312 and four holding portions 313 arranged at four points spaced at aninterval of 900 in a rotational direction of the circumference of theup-and-down rotary portion 312. In the embodiment, the holding portion313 includes suction nozzles 320 for holding the framed substrates 53and SAW filters 50 through a suction operation with the use of a suctiondevice 351 of the holding transfer device 311. The holding of the framedsubstrates 53 and SAW filters 50 by the holding portion 313 is releasedwhen the suction operation is freed. The suction device 351 is connectedto the control unit 601. Holding portions 313 arranged at the fourpoints are controlled by the control unit 601 to suck and stop suckingthe framed substrates 53 and SAW filters 50.

[0054] According to the present embodiment, five suction nozzles 320 arealigned in a row in the extension direction of the storage body 211 sothat five framed substrates 53 and five SAW filters 50 can be held atone time. The holding portion 313 is not limited to this kind of suctionnozzle 320 and the number of nozzles is not limited to five, either.

[0055] The up-and-down rotary portion 312 moves up and down along adirection of thickness of the framed substrate 53 and SAW filter betweena hold and loading position where the holding portion 313 holds theframed substrates 53 and loads the SAW filters 50, and a transferposition where the framed substrates 53 and SAW filters 50 aretransferred in a state while held by the holding portion 313. Moreover,the up-and-down rotary portion 312 rotates about an up-and-down shaft321 extending in parallel to the thickness direction when up at thetransfer position. The up-down movement and rotation of the up-and-downrotary portion 312 is achieved by a motor 314 in the embodiment, and theamount of the movement and rotation is detected by an encoder 315. Themotor 314 and encoder 315 are connected to the control unit 601, so thatthe amount of the above up-down movement and rotation is controlled bythe control unit 601.

[0056] The heating stage 331 is a device for preliminarily heating theframed substrates 53 so as to reliably mount the oscillating elements 54to the framed substrates 53 at the component mount stage 411. Theheating stage 331 is equipped with a heater 332 for heating a stageplate 333 on which the framed substrates 53 are loaded. In theembodiment, a heating temperature is approximately 250°. The heater 332is controlled in temperature by the control unit 601. The heating stage331 sucks to thereby hold the framed substrates 53 on the stage plate333.

[0057] Before the heated SAW filters 50 with the oscillating elements 54mounted thereon are stored in the storage body 211, the cooling stage341 is a device for cooling the SAW filters 50 to a temperature thatwill not damage the storage body 211 by heat. A cooling air is suppliedto a stage plate 342 where the SAW filters 50 are loaded, therebyremoving the heat of the SAW filters 50, according to the embodiment. Aflow rate of the cooling air is controlled by the control unit 601, thatis, cooling efficiency is controlled. Cooling by air is not the onlymethod of cooling the SAW filters 50. The SAW filters 50 are held on thestage plate 342 through the suction operation.

[0058] The mounting unit 401 will be described with reference to FIGS. 1and 9. The mounting unit 401 is used to mount the oscillating elements54 to the framed substrates 53, and includes the component mount stage411, a stage drive device 440, a component mount head 451, a componentmount head-driving device 461 and a component reverse feed head 471. Thestage drive device 440 moves the component mount stage 411 in a Ydirection that is orthogonal to an X direction on a plane supposing thatthe earlier-referred II direction of the storage body 211 is the Xdirection.

[0059] As is clearly shown in FIGS. 9 and 10, according to theembodiment, the component mount stage 411 is provided with a stage plate412 which holds five framed substrates 53 at one time through thesuction operation, and a pressing device 413 which presses confrontingperipheral edge parts 55 of the framed substrate 53 thereby fixing theframed substrate 53 to the stage plate 412 when the oscillating element54 is to be mounted to the framed substrate 53. The stage plate 412 isheated and kept at about 250° C. by a heating device set at a base 437supporting the stage plate 412. The temperature of the stage plate 412is detected by a thermocouple disposed at the stage plate 412, and atemperature of the heating device is controlled by the control unit 601.

[0060] The pressing device 413 has a pair of leaf springs 421 and a leafspring drive mechanism 414. One end of each leaf spring 421 is fixed toa frame member 422 of the component mount stage 411, while each of theother ends 421 a is made a free end. Accordingly, the free ends of leafsprings 421 can be in touch with and press the peripheral edge portions55 of the framed substrates 53. The leaf spring drive mechanism 414swings the leaf springs 421 to cause the leaf springs 421 to press theframed substrates 53 and release the pressing. Each leaf spring 421 hasa crease in the vicinity of a portion where the leaf spring is fixed tothe frame member 422, and generally, the other end 421 a is urged in adirection of an arrow 429. The leaf spring drive mechanism 414 isprovided for each of the leaf springs 421. So, the two mechanisms 414are constructed, but since the two mechanisms 414 are the samestructure, the description will be made for only one of the two. Theleaf spring drive mechanism 414 includes a leaf spring swing member 423,a transmission member 424, a drive member 425 and a driving device 426.The leaf spring swing member 423 is an L-shaped member supported nearlyat a central part thereof by a supporting shaft 427 mounted on the framemember 422 in a manner so that the leaf spring swing member 423 canswing. One end portion 423 a of the leaf spring swing member 423 isconnected in the vicinity of the other end 421 a of the leaf spring 421.Therefore, the one end portion 423 a and the other end portion 423 b ofthe leaf spring swing member 423 are turned in a direction of an arrow428 consequent to the swing of the leaf spring swing member about thesupporting shaft 427, thereby the other end portion 421 a of the leafspring 421 is moved in a direction of the arrow 429. On the other hand,when the one end portion 423 a and the other end portion 423 b areturned in a direction of an arrow 430, the other end portion 421 a ofthe leaf spring 421 is turned in a direction of an arrow 431 by the leafspring swing member 423 against the urging force. The transmissionmember 424 can slide in a thicknesswise direction of the framedsubstrate 53 while being supported by the frame member 422. One end 424a of the transmission member comes into contact with the other endportion 423 b of the swing member 423. The drive member 425 is a stripof plate as indicated in FIG. 11. A driving shaft 432 of the drivingdevice 426 is coupled to one end of the drive member 425. A central partof the drive member 425 is rotatably fitted to a pin 433 erected in abase plate 438 of the component mount stage 411. The driving member 425is accordingly rotatable about the pin 433 through the reciprocatorymovement of the driving shaft 432. A member 434 shaped like a wedge insection is mounted on the driving member 425, which comes in contactwith the other end 424 b of the transmission member 424 and moves thetransmission member 424 up and down in the thicknesswise direction inassociation with the rotation of the drive member 425 consequent to thereciprocation of the driving shaft 432.

[0061] Further, a positioning member is positioned at an upper face ofthe stage plate 412 at a rear side of the leaf spring 421 to positionthe framed substrates 53 on the stage plate 412 along a direction thatis orthogonal to the thicknesswise direction interlockingly with therotation of the drive member 425.

[0062] In the rotation of the drive member 425 because of thereciprocation of the driving shaft 432, when the transmission member 424moves, e.g., in a direction of an arrow 435, the leaf spring swingmember 423 turns in the direction of the arrow 430, thus moving theother end 421 a of the leaf spring 421 in the arrow direction 431 topress the peripheral edge portions 55 of the framed substrates 53 placedon the stage plate 412. At this time, the above positioning memberprevents the framed substrates 53 from moving in the directionorthogonal to the thicknesswise direction. Meanwhile, when thetransmission member 424 moves, for instance, in a direction of an arrow436 as a result of the rotation of the drive member 425 subsequent tothe reciprocation of the driving shaft 432, the leaf spring swing member423 rotates in the arrow direction 428 thereby moving the other end 421a of the leaf spring 421 in the arrow direction 429. And thus, thepressing by the leaf spring 421 to the framed substrates 53 is freed.

[0063] The stage drive device 440 has a motor 441 as a driving portionand a ball-screw structure including a screw rotated about an axisthereof by the motor 441 and a nut engaged with the screw. The baseplate 438 of the component mount stage 411 is fitted with the nut. Whenthe screw is rotated about the axis by the motor 441, the componentmount stage 411 reciprocates in the Y direction, between a deliveryposition 442 and a component mount position 443, as shown in FIG. 9. Theframed substrates 53 are loaded on the stage plate 412 and the SAWfilters 50 are transferred from the stage plate 412 when the componentmount stage 411 is present at the delivery position 442. On the otherhand, when the component mount stage 411 is located at the componentmount position 443, the oscillating elements 54 are mounted by thecomponent mount head 451 in the framed substrates 53 on the stage plate412.

[0064] The motor 441 is controlled by the control unit 601 whichcontrols the movement of the component mount stage 411 in the Ydirection.

[0065] The component mount head 451 employs suction to thereby holdingthe oscillating element 54 from the component reverse feed head 471 andmounts to the framed substrate 53 secured on the stage plate 412 of thecomponent mount stage 411. The component mount head 451 has a suctionnozzle 452 for holding the oscillating element 54 and an ultrasonicoscillation device 453 which is set to the suction nozzle 452 andoscillates the oscillating element 54 with ultrasonic waves to morestrongly connect the oscillating element 54 with the framed substrate 53via bumps. The suction nozzle 452 can be rotated about an axis thereofand moved up and down in an axial direction by a driving portion at ahead body 454. The operation of the thus-constituted component mounthead 451 is controlled by the control unit 601.

[0066] As shown in FIG. 12, the component mount head-driving device 461is constituted of a ball-screw structure for reciprocating the componentmount head 451 in the X direction by means of a screw 463 that canrotate about an axis by a driving motor 462 between a component holdposition 464 and a component mount position 465. The oscillating element54 is held from the component reverse feed head 471 at the componenthold position 464. The component mount position 465 corresponds to thecomponent mount position 443 of the component mount stage 411. Theoperation of the component mount head-driving device 461 is controlledby the control unit 601.

[0067] The component reverse feed head 471 holds the oscillating element54 as a component is supplied from the component feed unit 501 at acomponent feed stage portion 503, as in FIG. 1, and thereafter rotatesthe oscillating element 54 by 180° thereby turning the element upsidedown. The oscillating element 54 is held at the component hold position464 of the component mount head 451. The operation of the componentreverse feed head 471 is also controlled by the control unit 601.

[0068] In FIG. 1, the component feed unit 501 supplies the oscillatingelements 54 as the components to the component mounting apparatus 101,and has a feed magazine device 502 and the component feed stage portion503. The feed magazine device 502 stores a semiconductor wafer with afilm attached and scribed beforehand to the oscillating elements 54formed on the wafer. The semiconductor wafer is taken out from the feedmagazine device 502 and the film of the semiconductor wafer is extendedat the component feed stage portion 503 in the component feed unit 501.

[0069] At the time of mounting the oscillating element 54 to the framedsubstrate 53, the vertical visual field optical device 551 picks upimages of both the oscillating element 54 held by the component mounthead 451 and the framed substrate 53 loaded on the stage plate 412 ofthe component mount stage 411. The optical device 551, which is movablein the Y direction, is arranged above the component mount stage 411 atthe component mount position 443 and below the component mount head 451at the component mount position 465. The optical device 551 is connectedto the control unit 601. The control unit 601 finely adjusts themovement of the component mount stage 411 and the component mount head451 on the basis of information output from the optical device 551 sothat the bump of the oscillating element 54 maintains a predeterminedpositional relationship with respect to the electrode on the framedsubstrate 53.

[0070] The component pickup device 571 picks up an image of theoscillating element 54 held by the component reverse feed head 471 amongthe oscillating elements 54 arranged at the component feed stage portion503, and then supplies information for the control of the amount of themovement of the component reverse feed head 471 to the control unit 601.The component reverse feed head 471 is hence controlled in operation bythe control unit 601.

[0071] The operation of the component mounting apparatus 101 of theabove construction will be discussed below.

[0072] The storage body 211 storing the framed substrates 53 isintermittently transferred from the feed reel 221 along the arrowdirection II by the operation of the transfer device 231. Immediatelybefore the storage body 211 reaches the take-out storage position 292,the first protecting member 215, attached to the upper face 212 b of thestorage body 211, is detached and wound by the removal device 241. Inthe present embodiment, it is detected by the light-emitting detectingdevice 290 whether any framed substrate 53 is stored in the storagesection 212 when five framed substrates 53 are arranged at the take-outstorage position 292. When the framed substrate 53 is stored in everyone of the five storage sections 212, the take-out and storage unit 301executes a take-out operation and a storage operation to be describedbelow. If the framed substrates 53 are not stored in all of the fivestorage sections 212, the framed substrate 53 is added to the emptystorage section 212 or the take-out operation is executed in a statewhere the empty storage section is left as it is, or the storage body211 is transferred until it is detected that every storage section 212holds the framed substrate 53, and the like.

[0073] Referring to FIG. 7, in the embodiment, four holding portions 313are denoted as 313-1 to 313-4 in the clockwise rotational direction forthe convenience of explanation.

[0074] The holding portion 313-1, which has the five suction nozzles 320and is arranged to face the take-out storage position 292 of the feedcollection unit 201, sucks the framed substrates 53 from five storagesections 212 at once when the up-and-down rotary portion 312 descends tothe hold and loading position and, after sucking, moves upward while theup-and-down rotary portion 312 moves to the transfer position. Inaccordance with the rotation by 90° of the up-and-down rotary portion312, five framed substrates 53 sucked by the holding portion 313-1 aretransferred to above the heating stage 331. The holding portion 313-4 ispositioned above the take-out storage position 292 subsequent to therotation of the up-and-down rotary portion. When the up-and-down rotaryportion 312 moves to the hold and loading position, five framedsubstrates 53 are placed on the heating stage 331 and held because ofthe suction operation of the heating stage 331. Thereafter, when theup-and-down rotary portion 312 moves to the transfer position, theholding portion 313-1 moves up and stands by for a mount time describedlater. The five framed substrates 53 placed on the heating stage 331 areheated for the mount time.

[0075] In this embodiment, the take-out and storage unit 301 carries outoperations whereby the framed substrates 53 are taken out from thestorage body 211, the SAW filters 50 are stored in the storage body 211,the framed substrates 53 are heated at the heating stage 331, theoscillating elements 54 are mounted to the framed substrates 53 at thecomponent mount stage 411 and the SAW filters 50 are cooled at thecooling stage 341. What requires the longest time among these operationsis when the oscillating elements 54 are mounted to the framedsubstrates, and therefore a Tact time at the takeout and storage unit301 is determined by the mount time. If a time for heating the framedsubstrates 53 to a predetermined preheating temperature, e.g., the abovementioned approximately 250° C. is longer than the mount time, theframed substrates 53 would be heated too high. In order to avoid thistrouble, according to the embodiment, the temperature of the stage plate333 of the heating stage 331 is controlled by the control unit 601 asdescribed before so that each framed substrate 53 becomes approximately250° C. immediately before being transferred to the component mountstage 411.

[0076] Once the up-and-down rotary portion 312 rotates one turn, theholding portion 313-4 is to store the held SAW filters 50 in the storagebody 211. However, only the holding portion 313-1 finishes holding ofthe framed substrates 53 at this moment and the holding portion 313-4has no operation to execute at the moment. The storage body 211 is sentby the transfer device 231 during the mount time to bring next fiveframed substrates 53 to the take-out storage position 292.

[0077] After the mount time lapses, the holding portion 313-1 sucks thefive framed substrates 53 placed on the heating stage 331 subsequent tothe movement of the up-and-down rotary portion 312 to the hold andloading position. At this time, the holding portion 313-4 holds the nextfive framed substrates 53 stored in the storage sections 212. Inaccordance with the movement of the up-and-down rotary portion 312 tothe transfer position after the movement to the hold and loadingposition, the holding portion 313-1 and the other holding portions 313move upwards. The 90° rotation of the up-and-down rotary portion 312sends the five framed substrates 53 sucked by the holding portion 313-1to a position above the component mount stage plate 412 located at thedelivery position 442 of the component mount stage 411. The holdingportion 313-4 moves to a position above the heating stage 331, while theholding portion 313-3 moves to a position above the take-out storageposition 292.

[0078] In the following movement of the up-and-down rotary portion 312to the hold and loading position, the five framed substrates 53 held bythe holding portion 313-1 are loaded on the stage plate 412 and suckedby the component mount stage 411. The holding portion 313-4 places theframed substrates 53 onto the stage plate 333 of the heating stage 331.

[0079] Then, because of the movement of the up-and-down rotary portion312 to the transfer position, the holding portion 313-1 and the otherholding portions 313 move up and wait. After the suction of the framedsubstrates 53, the leaf spring drive device 414 of the component mountstage 411 starts operating to move the other end 421 a of each leafspring 421 in the arrow 431 direction, so that the framed substrates 53are pressed and fixed on the stage plate 412 by the leaf springs 421.Since the stage plate 412 is heated beforehand, the framed substrates 53are heated and kept warm. Furthermore, after the framed substrates 53are fixed on the stage plate 412, the base plate 438 loading the stageplate 412 moves to the component mount position 443 of the componentmount stage 411 in the Y direction.

[0080] Before the stage plate 412 is moved to the component mountposition 443 as above, the component reverse feed head 471 holds oneoscillating element 54 from the component feed stage portion 503 andturns the oscillating element 54 upside down. The suction nozzle 452 ofthe component mount head 451 sucks a face of the reversed oscillatingelement 54 to which a circuit is not formed. The component mount head451 receives the oscillating element 54 from the component reverse feedhead 471 and sends the oscillating element 54 to the component mountposition 465 of the component mount head 451.

[0081] The vertical visual field optical device 551 moves in the Ydirection to below the oscillating element 54 held by the suction nozzle452 of the component mount head 451 and above the framed substrate 53,mounting the oscillating element 54, fixed to the stage plate 412 in thethicknesswise direction of the framed substrate 53 and oscillatingelement 54. The optical device 551 picks up images of both a circuitformation face of the oscillating element 54 and an electrode formationface of the framed substrate 53 at the same time and sends pickupinformation to the control unit 601. Based on the pickup information,the control unit 601 confirms a position of the framed substrate 53among the five framed substrates 53 to which the oscillating element 54is to be mounted, and moves at least one of the component mount heads451 and the component mount stage 411 so that the bump at the circuitformation face of the oscillating element 54 and the electrode on theframed substrate 53 are kept in a predetermined relationship so as tocorrespond to each other. After the bump is registered with theelectrode, the optical device 551 retreats in the Y direction, and thesuction nozzle 452 of the component mount head 451 is lowered, therebymounting the oscillating element 54 on the framed substrate 53. At thetime of the mounting, the ultrasonic oscillation device 453 is activatedto oscillate the oscillating element 54 with ultrasonic oscillations toachieve firm connection of the bump and the electrode. Oscillatingelements 54 are sequentially mounted on all the framed substrates 53 onthe stage plate 412 by repetition of the above series of operations. Amount time for one oscillating element 54 is approximately 3 seconds inthe embodiment, thus it takes at least 15 seconds to mount theoscillating elements 54 to all of the five framed substrates 53. Inother words, the above mentioned mount time is at least 15 seconds.

[0082] After the mounting of the oscillating elements 54 on all theframed substrates 53, the base plate 438 of the component mount stage411 is moved in the Y direction from the component mount position 443 tothe delivery position 442. The leaf spring drive mechanism 414 isstarted to operate after the base plate 438 is brought to the deliveryposition 442, and consequently the other end 421 a of the leaf spring421 is moved in the arrow direction 429 by the leaf spring swing member423, and thereby the SAW filters 50, which are formed by mounting theoscillating elements 54 on the framed substrates 53, are freed from thefixed positions on the stage plate 412.

[0083] The holding portion 313-1 sucks five SAW filters 50 on the stageplate 412 subsequent to the movement of the up-and-down rotary portion312 to the hold and loading position. At this time, the holding portion313-4 takes the framed substrates 53 from the heating stage 331, whilethe holding portion 313-3 holds the framed substrates 53 from thestoring sections 212. After sucking the SAW filters 50, the holdingportion 313-1 moves upward through the movement of the up-and-downrotary portion 312 to the transfer position. The other holding portions313 move up simultaneously with this. The five SAW filters 50, sucked bythe holding portion 313-1, are arranged above the stage plate 342 of thecooling stage 341 by the rotation by 90° of the up-and-down rotaryportion 312. Meanwhile, the holding portion 313-4 is located above thestage plate 412 of the component mount stage 411, the holding portion313-3 is located above the heating stage 331 and the holding portion313-2 is located above the take-out storage position 292 respectively.

[0084] Subsequently, as a result of the movement of the up-and-downrotary portion 312 to the hold and loading position, the five SAWfilters 50 held by the holding portion 313-1 are loaded onto the stageplate 342 of the cooling stage 341, whereby the SAW filters 50 aresucked and cooled by the stage plate 342. The holding portion 313-4places the framed substrates 53 onto the stage plate 412 of thecomponent mount stage 411, and the holding portion 313-3 loads theframed substrates 53 onto the stage plate 333 of the heating stage 331.

[0085] Then the movement of the up-and-down rotary portion 312 to thetransfer position, the holding portion 313-1 is kept waiting above thestage plate 342, and the other holding portions 313 move upward as well.

[0086] When the mount time passes, because of the movement of theup-and-down rotary portion 312 to the hold and loading position, theholding portion 313-1 sucks five SAW filters 50 on the stage plate 342of the cooling stage 341. On the other hand, the holding portion 313-4holds the framed substrates 53 by the stage plate 412 of the componentmount stage 411, holding portion 313-3 takes the framed substrates 53from the stage plate 333 of the heating stage 331 and the holdingportion 313-2 takes the framed substrates 53 from the storing sections212 of the storage body 211. The holding portion 313-1 and the otherholding portions 313 move up after the movement of the up-and-downrotary portion 312 to the transfer position. In consequence of therotation of the up-and-down rotary portion 312 by 90°, the five SAWfilters 50 sucked by the holding portion 313-1 are sent to a positionabove the take-out storage position 292 again. The holding portion 3134is set above the stage plate 342 of the cooling stage 341 at this time,while the holding portions 313-3 and 313-2 are disposed above the stageplate 412 of the component mount stage 411 and above the heating stage331 respectively.

[0087] By the movement of the up-and-down rotary portion 312 to the holdand loading position, the five SAW filters 50 held by the holdingportion 313-1 are stored in five storing sections 212 of the storagebody 211 which are emptied after the framed substrates 53 are takenoutside by the holding portion 313-2.

[0088] The framed substrates 53 are taken out from the storage body 211and the SAW filters 50 are stored in the storage body 211 by the holdingportion 313 sequentially and continuously afterwards.

[0089] As described above, the storage body 211 storing the SAW filters50 is transferred so that the framed substrates 53 are taken outtherefrom by the holding portion 313. At this time, the secondprotecting member 216 is adhered to the upper face 212 b of the storagebody 211 by the set device 251 immediately after the take-out storageposition 292. As the storage body 211 is further transferred, the secondprotecting member 216 is pressed to the upper face 212 b of the storagebody 211 by the pressing roller 254. The storage body 211 is transferredby the transfer device 231 in the arrow III direction and is finallywound on the collection reel 222. The storage body 211 storing the SAWfilters 50 and wound on the collection reel 222 is sent to a nextprocess together with the collection reel 222.

[0090] In the apparatus and method for mounting components according tothe present embodiment as above, individual framed substrates 53, eachseparated beforehand, are supplied in a state while stored in thestorage body 211, and then the oscillating elements 54 are mounted onthe framed substrates 53, whereby the SAW filters 50 are produced.Accordingly, damage to the junction between the bump and electrode orthe like inconvenience is prevented which would occur if each SAW filteris obtained by dividing a collective part of framed substrates 53 afterthe oscillating elements 54 are mounted thereon. Product quality isaccordingly improved. The produced individual SAW filters 50 arecollected again into the storage body 211 and consequently become easyto handle. The SAW filters can be sent to the next process while kept inthe storage body 211.

[0091] Since a plurality of stages are set at the take-out and storageunit 301 of a rotary system, the arrangement enables concurrentoperations of taking out the framed substrates 53 from the storage body211, storing the SAW filters 50 into the storage body 211, heating theframed substrates 53 by the heating stage 331, mounting the oscillatingelements 54 to the framed substrates 53 at the component mount stage 411and cooling the SAW filters 50 at the cooling stage 341. Thusproductivity is improved greatly.

[0092] In the component mounting apparatus 101, the takeout and storageunit 301 is not restricted to the aforementioned rotary type, forinstance, a take-out and storage unit 1101 may be employed in place ofthe take-out and storage unit 301, as in a component mounting apparatus102 shown in FIG. 13. The component mounting apparatus 102 is, however,constructed in the same manner, with regard to the other points, as thecomponent mounting apparatus 101.

[0093] As shown in FIG. 15, the take-out and storage unit 1101 includesa holding portion 1102 having suction nozzles 1103, an air slide table1104 for moving the holding portion 1102 set thereto in the Y direction,and an air slide table 1105 engaging with the air slide table 1104 andmoving the air slide table 1104 in the thicknesswise direction of theframed substrate 53. The air slide table 1105 is fixed to a frame memberof the component mounting apparatus 102. The suction nozzles 1103 aredriven by a suction device 1106 to suck and stop sucking. The air slidetable 1104 and air slide table 1105 are activated by driving devices1107, 1108 respectively. These suction device 1106, driving devices1107, 1108 are connected to the control unit 601 which controlsrespective operations. The operation of the component mounting apparatus102 is equal to that of the already described component mountingapparatus 101, the description of which is therefore omitted here.

[0094] The take-out and storage unit 1101 may be provided with theheating stage 331 and cooling stage 341 described above.

[0095] The feed collection unit 201 of the component mounting apparatus101 is not limited to, the above form of the tape-type transfer. Forexample, a tray-type feed collection unit 1111 may be installed as in acomponent mounting apparatus 103 of FIG. 14, in place of the feedcollection unit 201, and also a take-out and storage unit 1131 may beprovided in place of the take-out and storage unit 301. The componentmounting apparatus 103 is constituted in the other points in the samemanner as the component mounting apparatus 101.

[0096] The feed collection unit 1111 has a tray 1112 in which the framedsubstrates 53 are arranged, e.g., like a lattice on a plate, and amagazine portion 1113 for feeding and storing the tray 1112. Themagazine portion 1113 is connected to the control unit 601 andcontrolled in operation by the control unit 601.

[0097] As shown in FIG. 16, the take-out and storage unit 1131 has aholding portion 1132 with suction nozzles 1133, an air slide table 1135for attaching the holding portion 1132 and moving the holding portion1132 in the thicknesswise direction of the framed substrates 53, and anX, Y-robot 1136 having the air slide table 1135 fitted thereto andmoving the air slide table 1135 in X, Y directions. The X, Y-robot 1136is set at a frame member of the component mounting apparatus 103. Asuction device 1137 makes each suction nozzle 1133 suck and stop thesuction. The air slide table 1135 is driven by a driving device 1138.The suction device 1137, driving device 1138, X, Y-robot 1136 areconnected to the control unit 601 which controls respective operations.

[0098] In the component mounting apparatus 103 of the aboveconstruction, the framed substrates 53 are taken out from the tray 1112by the take-out and storage unit 1131 and placed on the stage plate 412of the component mount stage 411. Meanwhile, the SAW filters 50 havingthe oscillating elements 54 mounted thereto are caught by the take-outand storage unit 1131 at the stage plate 412 of the component mountstage 411 and stored again into the tray 1112.

[0099] The heating stage 331 and cooling stage 341 may be added to thetake-out and storage unit 1131.

[0100] As described above, the feed collection unit 201 of the componentmounting apparatus 101 has the protecting member removal device 241 andthe protecting member set device 251. Although it is preferred to attachthe first protecting member 215 and second protecting member 216 to thestorage body 211 to prevent dust, etc. for the framed substrates 53stored in the storing sections 212, the protecting member removal device241 and protecting member set device 251 are not essential. That is, asindicated in FIG. 17, a projecting member 1151 of a flexible materialmay be set at an opening part of the storing section 212 of the storagebody 211 to prevent the framed substrate 53 in the storing section 212from rattling or from slipping out of the storing section 212. Theprojecting member 1151 keeps in contact with the frame body 52 of theframed substrate 53 and is flexible, and therefore never hinders theframed substrate 53 from being taken out from the storing section 212and stored in the storing section 212. The projecting member 1151 can beformed so as to trace the whole periphery of the frame body 52 or tocorrespond to two opposite sides of the frame body 52.

[0101] The projecting member 1151 is not limited in shape to the thinelement as in FIG. 17 and can be formed in any shape so long as it canhold the divided components stored in the storing section 212 andfacilitate the take-out and storage of the component to the storingsection 212.

[0102] In the component mounting apparatuses 101-103, the ultrasonicoscillation device 453 may be eliminated at the component mount head451. Without the ultrasonic oscillation device 453, the framedsubstrates 53 can be connected to the oscillating elements 54 with theuse of, e.g., a thermosetting resin or by ACF junction, etc.

[0103] In the foregoing description, the component corresponding to theoscillating element 54 is a flat semiconductor chip. However, thecomponent may be a spherical semiconductor element, and in this case aleading end portion of the suction nozzle sucking the sphericalsemiconductor element is formed, for example, spherical to conform tothe spherical semiconductor element.

[0104] Although the present invention has been fully described inconnection with the preferred embodiment thereof with reference to theaccompanying drawings, it is to be noted that various changes andmodifications are apparent to those skilled in the art. Such changes andmodifications are to be understood as included within the scope of thepresent invention as defined by the appended claims unless they departtherefrom.

What is claimed is:
 1. A method for mounting component which comprises:taking out a divided component separated from a collective part from astorage body; mounting a component to the taken divided component; andstoring a divided component with the component mounted thereto into thestorage body again.
 2. The component mount method according to claim 1 ,which includes: removing a first protecting member covering the dividedcomponent immediately before taking out the divided component from thestorage body; and covering the divided component with the componentmounted thereto with a second protecting member after storing thedivided component with the component mounted thereto in the storagebody.
 3. The component mount method according to claim 2 , wherein thestorage body storing the divided component with the component mountedthereto and covered with the second protecting member is wound to a windmember.
 4. The component mount method according to claim 1 , whichincludes at least heating the divided component before mounting thecomponent after taking out the divided component from the storage body,and cooling the divided component with the component mounted theretobefore storing the same in the storage body after mounting thecomponent.